Isoflux's Hollow Cathode Magnetron Sources ... also known as inverted magnetrons use cylindrical targets to surround the substrate with coating materials.  Ideal to coat complex, 3 dimensional shapes, wires, fibers and many other substrates (see "markets and applications" link), the cylindrical magnetron design is considerably more efficient than planar magnetrons and offers extremely high deposition rates, excellent target utilization, less down-time and simple maintenance.

The cylindrical design allows entire 3-dimensional items to be coated at once without the need for rotation  The result is a more efficient and simple process.  Unlike planar magnetrons, the magnetic field in the cylindrical magnetron produces a uniform plasma and therefore leads to the more uniform use of materials.  The cylindrical magnetron utilizes approximately 75% of the target because most of the deposition material that is not deposited on the substrate is redeposited onto the target. 

This also means that the chamber does not need to be cleaned as often.  Thus, you'll spend less money on expensive target materials, fewer hours replacing targets and enjoy reduced machine downtime.

Interested in learning much, much more about hollow cathode magnetron sputtering?

CLICK HERE

(Principles and Applications of Hollow Cathode Sputtering Sources)

Reactive sputtering with cylindrical magnetrons?

CLICK HERE

 (AC Reactive Sputtering with Inverted Cylindrical Magnetrons) ; and

HERE

(High Powered Pulsed Reactive Sputtering)

Recent Developments?

CLICK HERE

... and Much More:

 Refer to our Main Page at www.isofluxinc.com for more info, including technical papers on biomedical applications.

  

HOLLOW CATHODE DESIGN FEATURES

Summary:

• Sputtering sources use cylindrical targets to surround substrate with coating materials.
• Provides high deposition rates and excellent target utilization.
• More efficient design compared to planar magnetrons.
• Less downtime and relatively inexpensive targets helps control process costs.